EPOXY RESINS
Use of epoxy resins and hardeners in the construction industry the world over has been considerably increased over the past two decades. Epoxy Resin systems possess many advantageous properties such as quick curing at room temperature without application of heat, low shrinkage, good chemical resistance and mechanical properties etc. These resins can be further modified in formulating resin rich mortars, putties, or coating compounds with addition of coaltar and other additives. These properties combined with versatility in choice make epoxy resins an ideal choice for many civil engineering applications.
Why use Epoxy Resins

Epoxy Resin is a condensation product of Bisphenol - A and Epichlorohydrine. Epoxy Resin, in combination with curing agent by chemical reaction either at room temperature or at elevated temperature turns into solid mass.

The commonly used curing agents (hardeners) are polyamines, polyamides, liquid and solid anhydrides and adduct compounds. The characteristic properties of cured epoxy resin system relevant to civil engineering applications are:

High adhesive strength to almost all materials.
Low shrinkage during curing
Exceptional dimensional stability
Thermo-setting
Natural gap filling ability
Good mechanical properties and chemical resistance
Ease of application
Ability to cure in wet conditions, (special combinations)
Properties of Concrete, Cement Mortar and Epoxy Resin based Mortar
Epoxy Resins and epoxy resin based mortar possess several important characteristics which can be advantageously used for civil engineering applications. Compared to the properties of concrete or cement mortar, epoxy resins have high tensile strength, high flexural strength, high compressive strength and excellent adhesive strength. In addition to excellent mechanical properties and adhesive strength, resistance to chemi­cals, sea water and corrosive atmosphere are added advantages of epoxy based mortars.
Applications of Epoxy Resins
1. Civil Engineering
Epoxy Resins and epoxy based compounds have found several applications in the civil engineering field. The major applications in which epoxy systems have been successfully used are
Grouting of cracks in concrete.
Bonding of hardened to hardened and hardened to fresh concrete.
Abrasion resistant and corrosion resistant coating on concrete surfaces
Joining concrete to metal
Plugging leaks of hydraulic structures
Airfield runway repairs
Corrosion and chemical resistant coatings
Water proofing
Grouting of machine foundation bolts and preparing base for heavy machines.
2. Electronics & Electrical Engineering
HT/LT switchgear components
Insulators, slip Rings, Busbars, Solenoids, Arc pot tubes etc.
Dry type current & voltage transformers
Electronic components such as Deflection coils, Capacitors, Resistors etc.
Masking of electronic circuits on PCBs.
Auto electricals such as ET coils etc.
Glued insulated rail joints.
Joining of both power and communications cables.
3. FRP (Composites)
General purpose laminates for electrical insulation.
NEMA G-10 laminates for PCBS
NEMA G-11 laminates for slot wedges etc., as insulation.
General purpose hand laying up flame retardant laminates for insulation purpose.
Fire retardant glass epoxy laminates to NEMA FR-4 & FR-5 specifications.
Bonding letheroid paper to polyester film.
Bonding Mica splits/paper
Filament wound pipes for chemical plant borewells, electrical applications etc.
Lining of tanks for chemical storage, neutralization pits, pickling tanks, etc.
4. Surface Coating
Epoxy Varnishes
Solvent based surface coatings
Dry type current & voltage transformers
Epoxy esters for stoving and air drying finishes 4.Powder coating
5. Mechanical Engineering
Foundry Patterns
Keller Models and Die sinking masters.
6. ADHESIVES
Miscellaneous bonding in Speakers, energy meters etc.
Reinforcement of hockey sticks and tennis recquets
Miscellaneous bonding in washing machines, wet grinders etc.
Miscellaneous bonding of lamps and bangles, Pens etc.
Liquid Epoxy Resins

Specific Gravity at 25°C

Viscosity CP at 25°C

Epoxide Equivalent

Type Applications

1.11-1.16

1400-2000

205-240

Modified Solventless Resin

A

1.14-1.20

9500-13000

182-200

Unmodified Solventless Resin

A

1.18-1.22

25000-50000

232-266

Modified Solventless Resin

A

j 15-1.20

4500-6500

174-189

Modified Solventless Resin

C

1 11-1.16

900-1500

200-230

Modified Solventless Resin

C

1.14-1.19

9500-13500

181-198

Unmodified Solventless Resin

c

1.12-1.18

1350-1950

210-235

Modified Solventless Resin

A

1 11-1.16

680-1300

177-200

Modified Solventless Resin

C,D

1.11-1.16

550-800

173-200

Modified Solventless Resin

C,D

1.12-1.17

900-1400

227-250

Modified ResinB

 

1.11-1.17

1200-1800

200-220

Modified ResinC.D

 

1.15-1.20

9000-13000

180-200

Unmodified Solventless Resin

B

1.12-1.17

1300-1900

208-238

Modified Solventless Resin

B

1.10-1.15

400-600

178-188

Modified Solventless Resin

B

1.12-1.17

1300-1900

208-238

Modified ResinB

 

1.15-1.20

12500-17000

180-200

Unmodified Solventless Resin

C

1.125-1.170

1250-1900

206-242

Modified Solventless Resin

G

1.14-1.20

8500-13000

180-200

Unmodified Solventless Resin

E

1.14-1.18

200-400

250-280

Unmodified Solventless Resin

H,A

1.15-1.19

9200-13200

182-202

Unmodified Solventless Resin

D

1.24-1.28

25000-60000

208-235

Modified Solventless filled Thixotropic Resin

D

1.17-1.21

25000-70000

227-270

Modified Solventless Resin
A

1.13-1.19

8500-13500

178-200

Unmodified Solventless Resin

A,B,E

1.13-1.18

1200-1900

210-240

Modified Solventless Resin

A.B.E

1.15-1.20

12000-17500

178-200

Unmodified Solventless Resin

A,B